Basic information: | |
Released | 2019 |
Segment | Mobile |
Socket | BGA1440 |
Bus | 8 GT/s DMI |
Number of cores | 4 |
Number of threads | 8 |
Base frequency | 2500 MHz |
Turbo Boost | 4300 MHz |
Unlocked multiplier | no |
Architecture (core) | Coffee Lake-H |
Lithography | 14 nm |
TDP | 45 W |
Max. temperature | 100° C |
Products webpage | follow > |
Internal memory | |
L1 Cache, Кb | 4x32 + 4x32 |
L2 Cache, Кb | 4x256 |
L3 Cache, Кb | 8192 |
Integrated modules | |
iGPU |
Intel UHD Graphics 630 350 - 1100 MHz |
Memory controller | 2-channel (LPDDR3-2133, DDR4-2666) |
PCIe controller | PCI Express 3.0 (16 lines) |
Other modules | no |
Instructions, technology | |
• MMX • SSE • SSE2 • SSE3 • SSSE3 • SSE4 (SSE4.1 + SSE4.2) • AES (Advanced Encryption Standard inst.) • AVX (Advanced Vector Extensions) • AVX 2.0 (Advanced Vector Extensions 2.0) • BMI1, BMI2 (Bit Manipulation inst.) • F16C (16-bit Floating-Point conversion) • FMA3 (3-operand Fused Multiply-Add inst.) • EM64T (Intel 64) |
• NX (XD, Execute disable bit) • VT-x (Virtualization technology) • VT-d (Virtualization for directed I/O) • Hyper-Threading • Turbo Boost • TXT (Trusted Execution tech.) • TSX (Transactional Synchronization Extensions) • MPX (Memory Protection Extensions) • SGX (Software Guard Extensions) • SMAP (Supervisor Mode Access Prevention) • SMEP • Enhanced SpeedStep tech. |